Technical Paper Archive

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Damping Materials Based on Liquid Poly(butadiene)s: Structure-Property Relationships

B20 defrain paper

Event: 198th Technical Meeting - Fall 2020
Location: Virtual
Date: October 19, 2020
Author: Olivier Defrain; Steven K. Henning
Paper Number: B20

Price: $20.00

  • Damping materials are used to reduce or eliminate vibrations and noises mainly in industrial, transportation and structural applications. Several noise and vibration sources exist, such as ambient noise or mechanical vibration. Nowadays, several industries, such as the automotive industry, have developed a multiplicity of solutions to control noise and vibration over the last several decades. They are essential to optimize performance, or to improve personal comfort, health and safety. Today, sound and vibrational damping materials comprising liquid diene resins, such as liquid butadiene homopolymers and copolymers, are manufactured and applied at low temperature, in particularly inside car cabins to improve driving comfort. When cured, the latter possess higher damping performances than those of bitumen pads. The present paper highlights the characteristics of liquid polybutadienes and the properties of compositions having a real impact on their loss factor curves. By establishing structure-property relationships, it is possible to optimize the damping performances of sulfur-cured compositions containing liquid diene resins. Many industrial sectors wish to reduce their environmental footprint. One technical solution could be the substitution of sulfur-cured systems by another crosslinking agent, such as organic peroxides, in the case of liquid diene resins-based compositions. Indeed, the content of vulcanization agent is reduced while enabling their crosslinking on a large temperature range in order to minimize energy by curing at lower temperatures, or enabling a faster cure step. The shift from sulfur-cured systems to peroxide should improve the emission level / damping property balance of damping materials based on liquid diene resins.

    Papers from 198th Technical Meeting - Fall 2020

    Items from 198th Technical Meeting - Fall 2020