Technical Paper Archive

This site contains all papers presented at Rubber Division, ACS Technical Meetings from 2000-2018. Meetings prior to 2000 are incomplete and papers are added as they are digitized.

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"Eco" Friendly Curatives: A Tool to Assist in Developing Rubber Compounds that are Safer for the Environment and Better for Biological Health

A30 neilson eco curative paper acs rubber division 2019

Event: 196th Technical Meeting - Fall 2019
Location: Cleveland, OH
Date: October 08, 2019
Author: Joel Neilsen
Paper Number: A30

Price: $20.00

  • Rubber is an essential component of many every-day and specialized products used in a variety of ways. To produce rubber compounds with the physical properties necessary for good product performance, vulcanization systems may contain curatives that have negative environmental and/or biological impact. Fortunately, a significant number of curatives exist that will reduce the negative impact on health and environmental safety. This paper will present an overview of curatives that are more “eco” friendly but still appropriate and effective for various compound applications. Specifically the area of reducing or eliminating carcinogenic nitrosamine generating curatives will be explored. A novel approach to this is the use of Rhein Chemie’s Rhenogran® Zeolite-70 combined with resole resins to develop fast and heat stable vulcanizates in elastomers with low unsaturation. Additionally, Rhenocure® DR and Vulcuren® will be presented as safer alternatives to 1, 3-diphenyl guanidine (DPG) which produces large volumes of volatile organic compounds during decomposition. Several Rhenogran® and Rhenocure® products as replacements for ethylene-thiourea (ETU) which is considered both carcinogenic and mutagenic will also be discussed. This information will assist the rubber compounder in making choices that meet the compound performance needs as well as contribute to the overall environmental and biological health of our world.

    Papers from 196th Technical Meeting - Fall 2019

    Items from 196th Technical Meeting - Fall 2019