Technical Paper Archive


This site contains all papers presented at Rubber Division, ACS Technical Meetings from 2000-2018. Meetings prior to 2000 are incomplete and papers are added as they are digitized.


For older papers not listed here, please send your request, including Meeting Year, Title, Author, and Paper # to: cbrady@rubber.org


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An Engineer's Guide to Selecting Rubber-to-Substrate Adhesives

Pitia  emmanuel

Event: 185th Technical Meeting
Location: Louisville, KY
Date: March 24, 2014
Author: Emmanuel Pitia
Paper Number:

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  • Presentation Slides.
    Rubber-to-substrate bonding refers to the process of joining rubber, adhesive, and substrate. This is typically done through application of heat and pressure. The type of rubber, adhesive, and substrate vary depending on end-use application of the bonded article. LORD Chemlok® adhesives have been the market leader in the area of rubber-to-substrate bonding for over 55 years with proven performance and broad range of product offerings. With such a wide selection of products, selecting the right adhesive system can be daunting. The objective of this paper is to provide a guide to selecting an adhesive for a specific application and review the important concepts behind rubber-to-substrate bonding.

    Papers from 185th Technical Meeting

    Items from 185th Technical Meeting