Technical Paper Archive

This site contains all papers presented at Rubber Division, ACS Technical Meetings from 2000-2018. Meetings prior to 2000 are incomplete and papers are added as they are digitized.

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Best Practices for Enhancing Rubber-to-Substrate Bonding

2014fall 92

Event: 186th Technical Meeting
Location: Nashville, TN
Date: October 14, 2014
Author: Jeffrey D. Means* and Mason V. Myers
Paper Number: 92

Price: $20.00

  • In the rubber-to-substrate bonding industry, there are a variety of applications that require robust adhesion utilizing Chemlok@ adhesive systems. These applications include noise and vibration control devices, seals and gaskets, rubber rollers and wheels as well as many other bonded assemblies. In each of these applications, important process steps such as substrate preparation, elastomer molding, adhesive system selection, handling, and application are essential to producing quality rubber-to-substrate assemblies. This paper focuses on industry case studies that demonstrate the best practices for various aspects of rubber-to-substrate bonding. Examples will be provided to highlight the proper
    techniques in each of the key processing areas of rubber-to-substrate bonding.

    Papers from 186th Technical Meeting

    Items from 186th Technical Meeting