Technical Paper Archive

This site contains all papers presented at Rubber Division, ACS Technical Meetings from 2000-2018. Meetings prior to 2000 are incomplete and papers are added as they are digitized.

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Carbon Footprint Comparison of Aqueous and Solvent Adhesive Systems used in Rubber-to-Substrate Bonding


Event: 182nd Technical Meeting
Location: Cincinnati, OH
Date: October 09, 2012
Author: Patrick A. Warren*, Tejbans S. Kohli, and Mason V. Myers LORD Corporation
Paper Number: 99

Price: $20.00

  • Solvent-borne adhesive systems have been a key part of engineered rubber components since the 1950s. Flecent breakthroughs in polymer film forming technologies and the development of novel and more effective compositions of matter have enabled new aqueous systems that meet and surpass the high standards set by solvent systems. It is well known that aqueous adhesive systems are the best choice to address the need to comply with reduced volatile organic compounds (VOC) limits facing the industry. Through the use of a Life Cycle Analysis, the carbon footprint of solvent-based systems is calculated to be about twice that of aqueous systems. This further highlights the favorable impact that aqueous systems have for this key sustainability driver.

    Papers from 182nd Technical Meeting

    Items from 182nd Technical Meeting