Technical Paper Archive

This site contains all papers presented at Rubber Division, ACS Technical Meetings from 2000-2018. Meetings prior to 2000 are incomplete and papers are added as they are digitized.

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Failure Analysis Techniques for Rubber-to-Substrate Bonding


Event: 182nd Technical Meeting
Location: Cincinnati, OH
Date: October 09, 2012
Author: Joshua Drab*
Paper Number: 96

Price: $20.00

  • Fiubber-to-substrate bonding is achieved with commercially available bonding agents that are designed to withstand the harsh environments that the end component may be exposed to during service. Applications include anti-vibration components such as automotive and industrial engine mounts as well as suspension bushings, dynamic seals and gaskets, rubber rollers and wheels, reinforced goods (i.e., hose and belt) and many other rubber-to-substrate applications. The main manufacturing processes include preparation of the substrate, bond agent application and vulcanization of the rubber. Although monitoring of process and materials is an important task for adhesion quality, bond failures do occur from variation in materials andlor manufacturing process, and to a lesser degree from in-service issues. Failure analysis techniques, or troubleshooting, typically employ a stepwise, practical approach. First, background details are required to select the most appropriate method for analysis. Second, failure analysis is completed with simple or complex scientific techniques. Finally, the goal of failure analysis is to provide immediate corrective action and to help prevent future occurrences. Utilizing best practice techniques, several case studies will be presented for this topic.

    Papers from 182nd Technical Meeting

    Items from 182nd Technical Meeting