Technical Paper Archive


This site contains all papers presented at Rubber Division, ACS Technical Meetings from 2000-2018. Meetings prior to 2000 are incomplete and papers are added as they are digitized.


For older papers not listed here, please send your request, including Meeting Year, Title, Author, and Paper # to: cbrady@rubber.org


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ADVANCES IN MICRONIZED RUBBER POWDER

37

Event: 182nd Technical Meeting
Location: Cincinnati, OH
Date: October 09, 2012
Author: F. P. Papp
Paper Number: 37

Price: $20.00

  • Previous publications by this author have described recommended methods of incorporation of micronized rubber powder, (M RP), into rubber compounds, including optimization of important physical properties. This paper provides important advances in MRP compound technology - Micronized Rubber Powder at 10% loadings and Functionalized Micronized Rubber Powder (FMRP). Both advances enable higher loadings of MRP in premium, demanding rubber products to achieve cost savings, performance and higher sustainability content. The first advancement discussed in this paper is a new understanding as to optimum MRP particle size distribution and surface area providing the ability to increase MRP loading levels to 10% while maintaining key properties, such as stress-strain, fuel economy and dry handling for tires, and improving others, namely fatigue to failure, crack growth resistance, and consistency. The second advancement discussed is a new concept for the future of the sustainable rubber materials industry called functionalized micronized rubber powder (FMRP). The results of technologies obtained from around the world were evaluated in Lehigh's Application & Development Center and by outside labs. Initial results show equivalent stress-strain, higher fatigue resistance, lower heat build-up and compression set vs. a control compound that help enable more durable end products for dynamic applications, e.g. tires, conveyor belts, and improvement in fuel economy, dry handling while maintaining wet traction for tire applications.

    Papers from 182nd Technical Meeting

    Items from 182nd Technical Meeting